Nitrogen and dry air purge is costly and will only provide a storage environment by forcing moisture from the storage cabinet.Baking process uses high temperature to dry PCBs which causes breakdowns of protective coatings, lead oxidation, intermetallic buildup and warping that reduces solder ability of circuit boards.Eureka Fast Super Dryer also dehumidifies during storage, solving Issues with traditional industry drying methodsĮureka’s dry cabinets, dry boxes, and desiccators will provide ultra-low humidity storage environment conforming to IPC/JEDEC J-STD 033 & IPC-1601, storage and handling standards for MSDs and PCBs.Įureka Fast Super Dryer also dehumidifies during storage, providing alternative drying methods optimal for removing moisture in all moisture sensitive materials in SMT production, solving all moisture damage problems during reflow process. This is done without using nitrogen (N2) / dry air purging, baking oven, or vacuum drying, which can solve complicated moisture problems and increase yield rate in R&D and high-tech EMS industries. ![]() ![]() Eureka's Fast Super Dryer meets IPC/JEDEC standards J-STD-033B (J-STD-033C Revision Feb., 2012) and provides dehumidification levels of <5%RH, <10%RH, <20%RH and 10~50%RH with fast recovery time at NTP (normal temperature/pressure) conditions.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |